- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/6594 - Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
Patent holdings for IPC class H01R 13/6594
Total number of patents in this class: 644
10-year publication summary
58
|
63
|
67
|
98
|
80
|
59
|
68
|
53
|
31
|
8
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
92 |
Molex, LLC | 1792 |
43 |
Lotes Co., Ltd. | 346 |
39 |
Advanced Connectek Inc. | 338 |
28 |
TE Connectivity Solutions GmbH | 2580 |
25 |
Japan Aviation Electronics Industry, Limited | 1585 |
21 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
16 |
Hon Hai Precision Industry Co., Ltd. | 4157 |
14 |
Samsung Electronics Co., Ltd. | 131630 |
13 |
Apple Inc. | 50209 |
13 |
Amphenol Corporation | 748 |
12 |
Sumitomo Wiring Systems, Ltd. | 9367 |
11 |
Huawei Technologies Co., Ltd. | 100781 |
9 |
FCI USA LLC | 200 |
9 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
8 |
Hosiden Corporation | 428 |
8 |
Magna Electronics Inc. | 1276 |
8 |
Dongguan Luxshare Technologies Co., Ltd. | 191 |
8 |
Sumitomo Electric Industries, Ltd. | 14131 |
7 |
Microsoft Technology Licensing, LLC | 51439 |
7 |
Other owners | 253 |